Ceramic Semiconductor Packages

Ultra small ceramic packages help miniaturize highly functional crystal devices which are essential in electronics.

Ceramic semiconductor packages.

Ball spacing less than 1 mm. A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. A semiconductor package is a metal plastic glass or ceramic casing containing one or more discrete semiconductor devices or integrated circuits individual components are fabricated on semiconductor wafers commonly silicon before being diced into die tested and packaged the package provides a means for connecting it to the external environment such as printed circuit board via leads. A package with metric pin distribution 0 5 mm pitch.

These ceramic and metal can packages are of. Three engineers from fairchild. The body of the component is ceramic. Is a world wide authorized distributor of packages and lids for ic assembly.

High pin count semiconductor packaging. Micro ball grid array μbga. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Cerpac packages sold in three separate components cerpac base cerpac frame and cerpac cap.

However the simple construc. This was the first real semiconductor package. The pressed ceramic packages are typically lower in cost than the multilayer packages. Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications.

Miniature ceramic packages for crystal devices. Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements. Located in silicon valley spectrum semiconductor materials inc. These packages protect the crystal with full hermetic sealing for high reliability while measuring just 1 0 x 0 8 mm among the world s smallest.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Spectrum semiconductor materials extensive inventory of ceramic cerpac packages are available in 14 18 20 24 and 28 pin configurations. For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs. The first semiconductor package.

Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. Ceramic column grid array ccga.